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The TIPS Project "Medical applications will be realised where miniaturisation and high functionality are primary objectives"
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The TIPS ProjectFramework 7

3D packaging provides the solution to device manufacturers who are attempting to overcome the miniaturisation challenge. Often the 2D area gets translated into 3D volume, resulting in a smaller footprint but higher packages. The TIPS project aims to overcome this challenge through innovative development of ultra thin stacked packages. The consortium, made up of leaders in their respective fields, is ideally placed to overcome the significant challenges of industrialisation.

Framework 7

The TIPS consortiums acknowledge the financial and management contribution made under FP7 program. For more information on FP7 and working in collaborations please visit CORDIS Framework 7

 

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